Part number:
Manufacturer
- Allegro MicroSystems
- Analog Devices Inc.
- Analog Devices Inc./Maxim Integrated
- Asahi Kasei Microdevices/AKM
- Atmel
- Broadcom Limited
- Cirrus Logic Inc.
- Freescale Semiconductor
- IDT, Integrated Device Technology Inc.
- Infineon Technologies
- Intersil
- Melexis Technologies NV
- Microchip Technology
- National Semiconductor
- NXP USA Inc.
- onsemi
- Renesas
- Renesas Electronics America Inc.
- STMicroelectronics
- Texas Instruments
Model Series
- *
- -
- AD9840
- AD9847
- AD9929
- AD9995
- Automotive, AEC-Q100
- cLite™
- LT®
- QTwo™
- TPS
Package
- -
- Bag
- Box
- Bulk
- Cut Tape (CT)
- Strip
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Discontinued at
- Last Time Buy
- Not For New Designs
- Obsolete
Type
- -
- ADC, DAC
- Automotive
- Battery Management
- Biometric Sensor Hub
- Capacitance-to-Digital Converter
- Capacitive Sensor
- Capacitive Touch and Proximity Sensor
- Capacitive Touch Screen Controller
- CCD Signal Processor, 10-Bit
- CCD Signal Processor, 12-Bit
- CCD Signal Processor, 14-Bit
- Clock Generator
- Controller
- Converter
- Current Loop Protector
- Current Transmitter
- Data Acquisition
- Detector Controller
- Distance Measuring, Preamplifier
- Distributed Systems Interface
- Engine Knock Signal Processor
- Front End
- Hall Effect Sensor
- Hall Effect Switch
- Horn Driver
- Hub
- Image Sensor
- Interface
- Level Shifter
- Motion Coprocessor
- Optical
- Output Driver
- Piezoelectric - Strain Gauge
- Power Management
- Pressure Sensor
- Programmable Amplifier/Attenuator
- Proximity Detector
- R/D Converter
- Relay/Load Driver
- Resistive
- Sensor Conditioner
- Sensor Interface
- Sensor Interface - Unprogrammed
- Sensor Interface, Signal Conditioner
- Serializer
- SFP Laser Controller
- SFP+ Controller
- Signal Conditioner
- Signal Processor
- Smart Sensor
- Smoke Detector
- Temperature Sensor
- Thermocouple Amplifier
- Thermocouple Conditioner
- Thermocouple to Digital Converter
- Time to Flight to Digital Converter
- Touch Sensor
- Translator
- Variable Reluctance
Input Type
- -
- 4 ~ 20mA
- Analog
- Analog Current
- Analog Voltage
- Analog, Digital
- Analog, Logic, Photodiode
- Capacitive
- CML
- CMOS
- Differential
- Digital
- Ionization
- Logic
- LVDS
- Parallel
- Photodiode
- Photoelectric
- Serial
- Thermocouple
- Thermocouple (J)
- Thermocouple (K)
- Thermocouple (Multiple)
- Ultrasound
- Voltage
Output Type
- -
- 1-Wire®
- 1-Wire®, I²C
- 1-Wire®, I²C, SPI
- 2-Wire
- 3-Wire Serial
- 3-Wire SPI Serial
- 4 ~ 20mA
- 4-Wire Serial
- Analog
- Analog Voltage
- Analog, Digital
- CML
- CMOS
- Current
- Differential
- Digital
- Digital, I²C
- Digital, Serial
- ISO9141
- I²C
- I²C, 2-Wire Serial
- I²C, Serial
- I²C, SPI
- LIN
- Logic
- LVDS
- Parallel
- Serial
- Serial, SPI
- SPI
- Thermocouple
- Voltage
Operating Temperature
- -
- -10°C ~ 60°C
- -10°C ~ 60°C (TA)
- -20°C ~ 105°C (TA)
- -20°C ~ 45°C
- -20°C ~ 75°C
- -20°C ~ 85°C
- -25°C ~ 105°C (TA)
- -25°C ~ 75°C
- -25°C ~ 85°C
- -40°C ~ 100°C
- -40°C ~ 105°C
- -40°C ~ 105°C (TA)
- -40°C ~ 110°C
- -40°C ~ 115°C
- -40°C ~ 120°C
- -40°C ~ 125°C
- -40°C ~ 125°C (TA)
- -40°C ~ 125°C (TJ)
- -40°C ~ 140°C
- -40°C ~ 150°C
- -40°C ~ 150°C (TA)
- -40°C ~ 85°C
- -40°C ~ 85°C (TA)
- -40°C ~ 90°C (TA)
- -40°C ~ 95°C
- -55°C ~ 125°C
- -55°C ~ 125°C (TA)
- -55°C ~ 150°C
- 0°C ~ 50°C
- 0°C ~ 60°C (TA)
- 0°C ~ 70°C
- 0°C ~ 70°C (TA)
- 0°C ~ 85°C
- 0°C ~ 90°C
- 150°C
- 20°C ~ 85°C
- 25°C ~ 100°C
Mounting Type
- -
- Surface Mount
- Surface Mount, Wettable Flank
- Through Hole
Package / Case
- -
- 10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- 10-VFDFN Exposed Pad
- 10-WFDFN Exposed Pad
- 100-LFBGA, CSPBGA
- 105-LFBGA, CSPBGA
- 112-LFBGA, CSPBGA
- 12-LFLGA
- 12-WFBGA, WLBGA
- 12-WFDFN Exposed Pad
- 12-WFQFN Exposed Pad
- 12-XFBGA, DSBGA
- 128-LFBGA, CSPBGA
- 14-CDIP (0.300", 7.62mm)
- 14-DIP (0.300", 7.62mm)
- 14-SOIC (0.154", 3.90mm Width)
- 14-SOIC (0.295", 7.50mm Width)
- 14-SSOP (0.209", 5.30mm Width)
- 14-TSSOP (0.173", 4.40mm Width)
- 14-VFQFN Exposed Pad
- 16-CDIP (0.300", 7.62mm)
- 16-DIP (0.300", 7.62mm)
- 16-SOIC (0.154", 3.90mm Width)
- 16-SOIC (0.154", 3.90mm Width), 14 Leads
- 16-SOIC (0.295", 7.50mm Width)
- 16-SSOP (0.154", 3.90mm Width)
- 16-SSOP (0.209", 5.30mm Width)
- 16-TSSOP (0.173", 4.40mm Width)
- 16-TSSOP (0.173", 4.40mm Width) Exposed Pad
- 16-UFBGA, WLCSP
- 16-UFQFN Exposed Pad
- 16-VFQFN Exposed Pad
- 16-VQFN Exposed Pad
- 16-VQFN Exposed Pad, CSP
- 16-WFBGA, WLBGA
- 16-WFQFN Exposed Pad
- 16-WQFN Exposed Pad
- 17-UFBGA, WLCSP
- 196-LFBGA, CSPBGA
- 20-CDIP (0.300", 7.62mm)
- 20-CLCC
- 20-LCC (J-Lead)
- 20-PowerTSSOP (0.173", 4.40mm Width)
- 20-SOIC (0.295", 7.50mm Width)
- 20-SOIC (0.295", 7.50mm Width) Exposed Pad
- 20-SSOP (0.209", 5.30mm Width)
- 20-TSSOP (0.173", 4.40mm Width)
- 20-VFDFN Exposed Pad
- 20-VFQFN Exposed Pad
- 20-VQFN Exposed Pad
- 20-WFQFN Exposed Pad
- 20-WFQFN Exposed Pad, CSP
- 24-CDIP (0.600", 15.24mm)
- 24-SOIC (0.295", 7.50mm Width)
- 24-SSOP (0.154", 3.90mm Width)
- 24-SSOP (0.209", 5.30mm Width)
- 24-UFBGA, WLCSP
- 24-VFQFN Exposed Pad
- 24-WFQFN Exposed Pad
- 25-TFBGA
- 28-DIP (0.500", 12.70mm), 22 Leads
- 28-LCC (J-Lead)
- 28-SOIC (0.295", 7.50mm Width)
- 28-SSOP (0.209", 5.30mm Width)
- 28-TSSOP (0.173", 4.40mm Width)
- 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
- 28-UFQFN Exposed Pad
- 28-VQFN Exposed Pad
- 28-WFQFN Exposed Pad
- 28-WFQFN Exposed Pad, CSP
- 32-TQFP Exposed Pad
- 32-WFQFN Exposed Pad
- 32-WFQFN Exposed Pad, CSP
- 33-UFBGA, WLCSP
- 35-UFBGA, WLCSP
- 36-UFBGA, DSBGA
- 36-VFQFN Exposed Pad
- 36-WFBGA, WLBGA
- 38-DIP (0.500", 12.70mm), 8 Leads
- 38-DIP (0.800", 20.32mm), 12 Leads
- 38-DIP (0.800", 20.32mm), 15 Leads
- 38-PowerTFSOP (0.173", 4.40mm Width)
- 38-TFSOP (0.173", 4.40mm Width) Exposed Pad
- 38-VFLGA Module
- 40-VFQFN Exposed Pad
- 40-VFQFN Exposed Pad, CSP
- 40-WFQFN Exposed Pad
- 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
- 44-LCC (J-Lead)
- 44-LQFP
- 48-LQFP
- 48-PowerTQFP
- 48-TQFP
- 48-TQFP Exposed Pad
- 48-VFQFN Exposed Pad, CSP
- 48-WFQFN Exposed Pad, CSP
- 49-VFBGA
- 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
- 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- 56-VFQFN Exposed Pad, CSP
- 6-WDFN Exposed Pad
- 64-LFBGA, CSPBGA
- 64-LQFP
- 64-PowerTQFP
- 64-QFP
- 64-VFQFN Exposed Pad, CSP
- 68-VFQFN Exposed Pad
- 70-LFBGA
- 8-CDIP (0.300", 7.62mm)
- 8-DIP (0.300", 7.62mm)
- 8-FlipChip
- 8-SOIC (0.154", 3.90mm Width)
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- 8-UFDFN Exposed Pad
- 8-VDFN Exposed Pad
- 8-VFDFN Exposed Pad
- 84-LFBGA, CSPBGA
- 84-TFBGA
- 84-VFQFN Dual Rows, Exposed Pad
- 9-WFBGA, WLBGA
- 96-LFBGA, CSPBGA
- Die
- Module
- TO-205AA, TO-5-8 Metal Can
Supplier Device Package
- -
- 0402/SOD-923F
- 10-HVSSOP
- 10-MSOP
- 10-TDFN (3x3)
- 10-TDFN (3x4)
- 10-uMAX
- 10-uMAX/uSOP
- 10-VSON (3x3)
- 10-VSON (3x4)
- 10-VSSOP
- 100-CSPBGA (9x9)
- 105-CSPBGA (8x8)
- 112-CSPBGA (8x8)
- 12-DIP
- 12-DSBGA (2.45x1.7)
- 12-LGA-CAV (2.8x5)
- 12-PDIP
- 12-TDFN (3x3)
- 12-TQFN (3x3)
- 12-WLP (2.14x1.56)
- 12-WSON (4x4)
- 128-CSPBGA (9x9)
- 14-CDIP
- 14-PDIP
- 14-QFN (4x4)
- 14-SO
- 14-SOIC
- 14-SSOP
- 14-TSSOP
- 16-CDIP
- 16-CERDIP
- 16-DIP
- 16-LFCSP-VQ (4x4)
- 16-PDIP
- 16-QFN (3x3)
- 16-QFN (4x4)
- 16-QSOP
- 16-SOIC
- 16-SSOP
- 16-TSSOP
- 16-TSSOP-EP
- 16-UQFN (3x3)
- 16-WLCSP (2.46x1.4)
- 16-WLP (1.55x1.57)
- 16-WQFN (4x4)
- 17-WLCSP (2.46x1.4)
- 196-CSPBGA (12x12)
- 20-CDIP
- 20-CLCC (9x9)
- 20-DFN (6x5)
- 20-HSOIC
- 20-HTSSOP
- 20-LFCSP (4x4)
- 20-MQFN (5x5)
- 20-PLCC (9x9)
- 20-QFN (4x4)
- 20-SOIC
- 20-SSOP
- 20-TSSOP
- 20-VQFN (5x5)
- 24-CDIP
- 24-QFN (4x4)
- 24-QFN (4x5)
- 24-SO
- 24-SOIC
- 24-SSOP
- 24-TQFN (3.5x3.5)
- 24-TQFN (3x3)
- 24-TQFN (4x4)
- 24-VFQFPN (4x4)
- 24-WLCSP (2.62x1.8)
- 25-NFBGA (4x4)
- 28-DIP
- 28-LFCSP-WQ (4x4)
- 28-PLCC (11.51x11.51)
- 28-QFN (6x6)
- 28-SOIC
- 28-SSOP
- 28-TQFN (5x5)
- 28-TSSOP
- 28-TSSOP-EP
- 28-UQFN (4x4)
- 32-LFCSP-WQ (5x5)
- 32-STQFN (4x4)
- 32-TQFN (5x5)
- 32-TQFP (5x5)
- 33-WLCSP (3.11x2.14)
- 35-WLCSP (3.11x2.14)
- 36-DSBGA (3.66x3.66)
- 36-VQFN (6x6)
- 36-WLP (2.57x2.57)
- 38-HTSSOP
- 38-OLGA (4.1x4.5)
- 38-TSSOP-EP
- 40-LFCSP (6x6)
- 40-LFCSP-VQ (6x6)
- 40-QFN (5x5)
- 40-TQFN (5x5)
- 40-VFQFPN (5x5)
- 44-HSOP
- 44-PLCC (16.59x16.59)
- 44-TQFP (10x10)
- 48-HTQFP (7x7)
- 48-LFCSP (7x7)
- 48-LFCSP-VQ (7x7)
- 48-LFQFP (7x7)
- 48-LQFP (7x7)
- 48-TQFP (7x7)
- 48-TQFP-EP (7x7)
- 49-VFBGA (5x5)
- 54-SOIC
- 54-SOIC-EP
- 56-LFCSP (8x8)
- 56-LFCSP-VQ (8x8)
- 6-TDFN (3x3)
- 64-CSPBGA (9x9)
- 64-HTQFP (10x10)
- 64-LFCSP-VQ (9x9)
- 64-PQFP (14x14)
- 68-QFN (10x10)
- 70-GQFN (6x10)
- 8-CERDIP
- 8-DFN (2x3)
- 8-DFN (3x3)
- 8-DIP
- 8-FlipChip
- 8-MSOP
- 8-PDIP
- 8-QFN (2x2)
- 8-SO
- 8-SOIC
- 8-SON (3x3)
- 8-uMAX/uSOP
- 8-VSSOP
- 8-µMAX
- 84-AQFN (7x7)
- 84-CSPBGA (12x6)
- 84-CSPBGA (6x6)
- 84-TFBGA (6x6)
- 9-WLP (1.53x1.53)
- 96-CSPBGA (8x8)
- Die
- Micro8™
- Module
- PG-DSO-14-66
- PG-DSO-16
- PG-DSO-16-1
- PG-LQFP-64
- TO-5
- Wafer
Media
Stocking Options
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