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ZSC31015EIC

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ZSC31015EIC

ZSC31015EIC
DICE (WAFER SAWN) - FRAME

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Renesas Electronics America Inc.

Renesas Electronics America Inc.

Renesas Electronics Corporation pioneers intricate semiconductor solutions, empowering myriad intelligent devices to enhance human lives securely. A global leader in microcontrollers, analog products, and SoCs, Renesas shapes a limitless future across Automotive, Industrial, and ICT domains.

Bostock Quality Assurance

ZSC31015EIC Features

temperature drift, and non-linearityaccommodates bridges with spans < 1mV/Vand high offsetsignature, bridge connection checks, bridge shortdetection, power loss detection)Independently programmable high and lowclipping levelsInternal temperature compensation reference(no external components)with addition of single diodevoltage (12-bit resolution), absolute analogvoltage, digital one-wire interfaceavailable 5ms after power-upsample rate: 1mA down to 250A (typical)external JFETcalibration via one-wire interface±0.25% FSO @ -50 to 150°C

ZSC31015EIC Brief Description

Product Attributes

TYPEDESCRIPTIONSelect all
PackageTray
Product StatusActive
ProgrammableNot Verified

Active

Renesas Electronics America Inc.

Renesas Electronics America Inc.

Renesas Electronics Corporation pioneers intricate semiconductor solutions, empowering myriad intelligent devices to enhance human lives securely. A global leader in microcontrollers, analog products, and SoCs, Renesas shapes a limitless future across Automotive, Industrial, and ICT domains.

Bostock Quality Assurance

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