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XC17S40PD8C

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XC17S40PD8C

Xilinx
XC17S40PD8C
IC PROM PROG C-TEMP 5V 8-DIP

$18.19

Xilinx

Xilinx

Xilinx stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), Multiprocessor System on Chips (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). AMD stands in a distinctive position, facilitating applications that embody a dual nature of software-defined sophistication and hardware-honed optimization. This empowering of industries finds its zenith in the realms of Cloud Computing, 5G Wireless Connectivity, Embedded Vision, and the sprawling domain of Industrial Internet of Things (IIoT).

Bostock Quality Assurance

XC17S40PD8C Description

Buy high-quality XC17S40PD8C components from Xilinx at szcomponents. Our XC17S40PD8C parts undergo rigorous quality control to ensure they meet the highest industry standards, guaranteeing reliability and performance. The XC17S40PD8C is parts of the Configuration Proms for FPGAs in Obsolete The XC17S40PD8C can also be used as 4.75V ~ 5.25V Voltage Supply. It has an Operating Temperature range of 0°C ~ 70°C. This Configuration Proms for FPGAs is for Through Hole installation. The XC17S40PD8C provides a 8-DIP (0.300", 7.62mm) package/case. This Configuration Proms for FPGAs corresponds to a 8-PDIP package. The production status marked on szcomponents.com is for reference only. If you didn't find what you were looking for, you can get more valuable information by emails, such as the XC17S40PD8C Inventory quantity, preferential price, datasheet, and manufacturer. We are always happy to hear from you, so feel free to contact us.

Product Attributes

TYPEDESCRIPTIONSelect all
Supplier Device Package8-PDIP
PackageTube
Product StatusObsolete
ProgrammableNot Verified
Programmable TypeOTP
Memory Size400kb
Supply Voltage4.75V ~ 5.25V
Operating Temperature0°C ~ 70°C
Mounting TypeThrough Hole
Package / Case8-DIP (0.300", 7.62mm)

$18.19

Xilinx

Xilinx

Xilinx stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), Multiprocessor System on Chips (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). AMD stands in a distinctive position, facilitating applications that embody a dual nature of software-defined sophistication and hardware-honed optimization. This empowering of industries finds its zenith in the realms of Cloud Computing, 5G Wireless Connectivity, Embedded Vision, and the sprawling domain of Industrial Internet of Things (IIoT).

Bostock Quality Assurance

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