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$63.85
Xilinx
Xilinx stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), Multiprocessor System on Chips (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). AMD stands in a distinctive position, facilitating applications that embody a dual nature of software-defined sophistication and hardware-honed optimization. This empowering of industries finds its zenith in the realms of Cloud Computing, 5G Wireless Connectivity, Embedded Vision, and the sprawling domain of Industrial Internet of Things (IIoT).
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XC17S10XLPDG8C Description
Buy high-quality XC17S10XLPDG8C components from Xilinx at szcomponents. Our XC17S10XLPDG8C parts undergo rigorous quality control to ensure they meet the highest industry standards, guaranteeing reliability and performance. The XC17S10XLPDG8C is a Configuration Proms for FPGAs with Obsolete product status. It requires a supply voltage ranging from 3V ~ 3.6V. This part number works in temperatures from 0°C ~ 70°C. The XC17S10XLPDG8C offers Mounting Type features such as Through Hole. The XC17S10XLPDG8C provides a 8-DIP (0.300", 7.62mm) package/case. This part number is supplier device package of 8-PDIP. If you haven't found what you're seeking, you can acquire valuable information via email. This includes details on the XC17S10XLPDG8C inventory quantity, preferential pricing, datasheets, and the manufacturer. We're always eager to assist you, so don't hesitate to reach out. Feel free to contact us anytime at szcomponents.com.
Product Attributes
| TYPE | DESCRIPTION | Select all |
|---|---|---|
| Supplier Device Package | 8-PDIP | |
| Package | Tube | |
| Product Status | Obsolete | |
| Programmable | Not Verified | |
| Programmable Type | OTP | |
| Memory Size | 100kb | |
| Supply Voltage | 3V ~ 3.6V | |
| Operating Temperature | 0°C ~ 70°C | |
| Mounting Type | Through Hole | |
| Package / Case | 8-DIP (0.300", 7.62mm) |
$63.85
Xilinx
Xilinx stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), Multiprocessor System on Chips (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). AMD stands in a distinctive position, facilitating applications that embody a dual nature of software-defined sophistication and hardware-honed optimization. This empowering of industries finds its zenith in the realms of Cloud Computing, 5G Wireless Connectivity, Embedded Vision, and the sprawling domain of Industrial Internet of Things (IIoT).
Bostock Quality Assurance
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