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Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
Bostock Quality Assurance
JANTX2N3019/TR FEATURES
•JEDEC registered 2N3019 number. •JAN, JANTX, JANTXV and JANS qualifications are available per MIL-PRF-19500/391. •Rad hard levels are also available per MIL-PRF-19500/391.(For RHA datasheet see JANSD2N3019.) •RoHS compliant by design.
JANTX2N3019/TR DESCRIPTION
This 2N3019 NPN leaded silicon transistor device is military qualified for high-reliabilityapplications. Microsemi also offers numerous other transistor products to meet higher andlower power ratings with various switching speed requirements in both through-hole andsurface-mount packages.TO-5 PackageAlso available in:
JANTX2N3019/TR APPLICATIONS / BENEFITS
•Long leaded TO-5 package. •
Product Attributes
TYPE | DESCRIPTION | Select all |
---|---|---|
Series | Military, MIL-PRF-19500/391 | |
DC Current Gain (hFE) Minimum @ Ic, Vce | 50 @ 500mA, 10V | |
Current - Collector Cutoff (Max) | 10µA (ICBO) | |
Maximum Collector-Emitter Saturation Voltage at Base Current and Collector Current | 500mV @ 50mA, 500mA | |
Maximum Collector-Emitter Breakdown Voltage | 80 V | |
Collector Current (Ic) (Max) | 1 A | |
Supplier Device Package | TO-5 | |
Transistor Type | NPN | |
Package / Case | TO-205AA, TO-5-3 Metal Can | |
Mounting Type | Through Hole | |
Operating Temperature | -65°C ~ 200°C (TJ) | |
Maximum Power | 800 mW | |
Package | Tape & Reel (TR) | |
Product Status | Active |
Active
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.