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JANS1N6642US
$37.42
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
Bostock Quality Assurance
JANS1N6642US Description
Get top-notch JANS1N6642US components from Microsemi Corporation at szcomponents.com. Our JANS1N6642US parts undergo strict quality control to meet industry standards, ensuring reliability and performance. The JANS1N6642US Single Diodes is currently in Active. This Single Diodes is for Surface Mount installation. The JANS1N6642US comes in a D, SQ-MELF package. It is designed for surface mount applications in a D-5D package. If you haven't found what you're looking for, you can get important information through email. This includes details about the JANS1N6642US inventory, special pricing, datasheets, and the manufacturer. We're here to help, so feel free to reach out anytime at szcomponents.com.
Product Attributes
TYPE | DESCRIPTION | Select all |
---|---|---|
Package / Case | D, SQ-MELF | |
Mounting Type | Surface Mount | |
Capacitance at Vr, F | 5pF @ 0V, 1MHz | |
Current - Reverse Leakage @ Vr | 500 nA @ 75 V | |
Reverse Recovery Time (trr) | 5 ns | |
Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
Maximum Forward Voltage at Forward Current | 1.2 V @ 100 mA | |
Average Rectified Current (Io) | 300mA | |
Maximum DC Reverse Voltage | 75 V | |
Technology | Standard | |
Junction Operating Temperature | -65°C ~ 175°C | |
Supplier Device Package | D-5D | |
Package | Bulk | |
Product Status | Active |
$37.42
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.