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JANS1N6642US

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JANS1N6642US

JANS1N6642US
DIODE GEN PURP 75V 300MA D-5D
No Datasheet

$37.42

Microsemi Corporation

Microsemi Corporation

Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.

Bostock Quality Assurance

JANS1N6642US Description

Get top-notch JANS1N6642US components from Microsemi Corporation at szcomponents.com. Our JANS1N6642US parts undergo strict quality control to meet industry standards, ensuring reliability and performance. The JANS1N6642US Single Diodes is currently in Active. This Single Diodes is for Surface Mount installation. The JANS1N6642US comes in a D, SQ-MELF package. It is designed for surface mount applications in a D-5D package. If you haven't found what you're looking for, you can get important information through email. This includes details about the JANS1N6642US inventory, special pricing, datasheets, and the manufacturer. We're here to help, so feel free to reach out anytime at szcomponents.com.

Product Attributes

TYPEDESCRIPTIONSelect all
Package / CaseD, SQ-MELF
Mounting TypeSurface Mount
Capacitance at Vr, F5pF @ 0V, 1MHz
Current - Reverse Leakage @ Vr500 nA @ 75 V
Reverse Recovery Time (trr)5 ns
SpeedFast Recovery =< 500ns, > 200mA (Io)
Maximum Forward Voltage at Forward Current1.2 V @ 100 mA
Average Rectified Current (Io)300mA
Maximum DC Reverse Voltage75 V
TechnologyStandard
Junction Operating Temperature-65°C ~ 175°C
Supplier Device PackageD-5D
PackageBulk
Product StatusActive

$37.42

Microsemi Corporation

Microsemi Corporation

Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.

Bostock Quality Assurance

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