JS28F256P30BFA

JS28F256P30BFA Features

JS28F256P30BFA Features

JS28F256P30BFA Features

Table 2: MCP Part Number InformationPart Number CategoryCategory DetailsPackageProduct LineDensityRD = Micron MCP, leadedPF = Micron MCP, lead-freeRC = 64-ball Easy BGA, leadedPC = 64-ball Easy BGA, lead-free48F = Micron Flash memory only0 = No die4 = 256MbProduct FamilyP = Micron Flash memory (P30)IO Voltage and Chip ConfigurationZ = Individual Chip Enables0 = No dieParameter LocationBalloutLithographyFeaturesV = Virtual Chip EnablesVCC = 1.7 to 2.0V; VCCQ = 1.7 to 3.6VB/T = Bottom/Top parameterQ = QUAD+0 = DiscreteE = 65nm*Note:1. The last digit is assigned randomly to cover packaging media, features, or other specific configuration infor-mation. Sample part number: RC48F4400P0VB0E*Table 3: Discrete and MCP Part CombinationsPackageJSPCDensity256Mb256Mb512Mb(256Mb/256Mb)PF256Mb512Mb(256Mb/256Mb)Packing MediaBoot Configuration 1TrayTape and ReelTrayTrayTape and ReelTrayTrayTape and ReelTrayTrayTrayTape and ReelBTBTB/TBTB/TPart NumberJS28F256P30BFEJS28F256P30BFFJS28F256P30TFEPC28F256P30BFEPC28F256P30BFFPC28F256P30TFEPC48F4400P0VB0EEPC48F4400P0VB0EFPF48F4000P0ZBQEFPF48F4000P0ZTQEJPF48F4400P0VBQEFPF48F4400P0VBQEKPDF: 09005aef84566799p30_65nm_MLC_256Mb-512mb.pdf - Rev. D 9/15 EN3Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2013 Micron Technology, Inc. All rights reserved.