Products
Contact US
English
HIP6311ACB

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HIP6311ACB

Intersil
HIP6311ACB
IC REG CTRLR BUCK 20SOIC

Obsolete

Intersil

Intersil

Commencing January 1, 2018, Renesas and Intersil will unify, augmenting semiconductor potentials. This fusion melds Renesas' lauded MCU and SoC proficiencies with Intersil's power management and precision analog mastery. Resultant growth spans automotive, industrial, and broader domains, facilitating agile response to patrons' needs. The amalgamation, initiated in February 2017, blossomed in July under "One Global Renesas," catalyzing a synergistic effect. Join Renesas in fortifying its semiconductor market eminence.

Bostock Quality Assurance

HIP6311ACB Features

HIP6311ACB Applications

HIP6311ACB Functional Pin Description

VID4 (Pin 1), VID3(Pin 2), VID2 (Pin 3), VID1(Pin 4)and VID0 (Pin 5)COMP (Pin 6)FB (Pin 7)FS/DIS (Pin 8)GND (Pin 9)VSEN (Pin 10)PWM1 (Pin 15), PWM2 (Pin 14), PWM3 (Pin 11) andPWM4 (Pin 18)ISEN1 (Pin 16), ISEN2 (Pin 13), ISEN3 (Pin 12) andISEN4 (Pin 17)PGOOD (Pin 19)VCC (Pin 20)FN9035 Rev 1.00July 2004Page 3 of 16

Product Attributes

TYPEDESCRIPTIONSelect all
Product StatusObsolete
Clock SynchronizationNo
Frequency - Switching50kHz ~ 1.5MHz
Supply Voltage (Vcc/Vdd)4.75V ~ 5.25V
Output Phases4
Supplier Device Package20-SOIC
Number of Outputs4
Package / Case20-SOIC (0.295", 7.50mm Width)
TopologyBuck
Mounting TypeSurface Mount
Output ConfigurationPositive
Operating Temperature0°C ~ 70°C (TA)
FunctionStep-Down
Control FeaturesEnable, Frequency Control, Power Good
Output TypePWM Signal
PackageTube

Obsolete

Intersil

Intersil

Commencing January 1, 2018, Renesas and Intersil will unify, augmenting semiconductor potentials. This fusion melds Renesas' lauded MCU and SoC proficiencies with Intersil's power management and precision analog mastery. Resultant growth spans automotive, industrial, and broader domains, facilitating agile response to patrons' needs. The amalgamation, initiated in February 2017, blossomed in July under "One Global Renesas," catalyzing a synergistic effect. Join Renesas in fortifying its semiconductor market eminence.

Bostock Quality Assurance

All Product Part Number 0 - Z