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Obsolete
Intersil
Commencing January 1, 2018, Renesas and Intersil will unify, augmenting semiconductor potentials. This fusion melds Renesas' lauded MCU and SoC proficiencies with Intersil's power management and precision analog mastery. Resultant growth spans automotive, industrial, and broader domains, facilitating agile response to patrons' needs. The amalgamation, initiated in February 2017, blossomed in July under "One Global Renesas," catalyzing a synergistic effect. Join Renesas in fortifying its semiconductor market eminence.
Bostock Quality Assurance
Product Details
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HI5714/4CB Features
• Sampling Rate . . . . . . . . . . . . . . . . . . .40/60/75/80 MSPS • Low Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .325mW • 7.65 ENOB at 4.43MHz • Overflow/Underflow Three-State TTL Output • Operates with Low Level AC Clock • Very Low Analog Input Capacitance • No Buffer Amplifier Required • No Sample and Hold Required • TTL Compatible I/O • Pin-Compatible to Philips TDA8714 • Pb-free Available
HI5714/4CB Applications
• Video Digitizing • QAM Demodulator • Digital Cable Setup Box • Tape Drive/Mass Storage • Medical Ultrasound Imaging • Communication Systems
Product Attributes
| TYPE | DESCRIPTION | Select all |
|---|---|---|
| Analog Supply Voltage | 5V | |
| Number of Bits | 8 | |
| Digital Supply Voltage | 5V | |
| Sampling Rate Per Second | 40M | |
| Number of Inputs | 1 | |
| Operating Temperature | 0°C ~ 70°C | |
| Input Type | Single Ended | |
| Package / Case | 24-SOIC (0.295", 7.50mm Width) | |
| Data Interface | Parallel | |
| Supplier Device Package | 24-SOIC | |
| Configuration | ADC | |
| Mounting Type | Surface Mount | |
| Number of Analog-to-Digital Converters | 1 | |
| System Architecture | Folding Interpolating | |
| Package | Tube | |
| Reference Type | External | |
| Product Status | Obsolete |
Obsolete
Intersil
Commencing January 1, 2018, Renesas and Intersil will unify, augmenting semiconductor potentials. This fusion melds Renesas' lauded MCU and SoC proficiencies with Intersil's power management and precision analog mastery. Resultant growth spans automotive, industrial, and broader domains, facilitating agile response to patrons' needs. The amalgamation, initiated in February 2017, blossomed in July under "One Global Renesas," catalyzing a synergistic effect. Join Renesas in fortifying its semiconductor market eminence.
Bostock Quality Assurance
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